CDR Sample for Semiconductor Device Engineer (ANZSCO 233414)

This project was undertaken during the author’s postgraduate studies or professional role in advanced semiconductor research. The responsibilities included:

• • Designing the architectural layout of a new generation FinFET device to enhance performance and reduce power consumption for high-performance computing applications.
  • Utilizing advanced TCAD (Technology Computer-Aided Design) tools such as Sentaurus Process and Sentaurus Device to simulate fabrication steps and electrical characteristics.
  • Conducting extensive parametric studies to optimize device geometry, doping profiles, and material interfaces to achieve target specifications.
  • Performing comprehensive electrical characterization simulations, including I-V curves, C-V characteristics, and transconductance analysis, to validate the design.
  • Analyzing simulation results to identify potential reliability issues and proposing design modifications to mitigate hot carrier injection and bias temperature instability.
  • Collaborating with process integration engineers to ensure the designed device is manufacturable with current or emerging fabrication technologies.

• Skills & Technologies Demonstrated

• • Software: Sentaurus TCAD (Process, Device, Topo), Silvaco ATLAS/ATHENA, MATLAB (for data analysis and scripting), COMSOL Multiphysics (for advanced physical modeling).
  • Standards & Frameworks: ITRS (International Technology Roadmap for Semiconductors) guidelines, JEDEC standards (for device reliability testing).
  • Competencies: Advanced Device Physics, FinFET Design Principles, TCAD Simulation & Modeling, Semiconductor Process Integration Knowledge, Electrical Characterization & Analysis, Reliability Physics, Design for Manufacturability (DFM).

This career episode describes the skills applied during a research and development project focused on advanced materials and fabrication processes. Key duties included:

• • Investigating novel high-k dielectric materials for their potential application in next-generation memory devices (e.g., DRAM, NAND).
  • Developing Atomic Layer Deposition (ALD) recipes for precise thin film growth of selected high-k materials on silicon substrates.
  • Characterizing the physical and electrical properties of deposited dielectric films using techniques such as X-ray Diffraction (XRD), X-ray Photoelectron Spectroscopy (XPS), Atomic Force Microscopy (AFM), and Capacitance-Voltage (C-V) measurements.
  • Optimizing ALD process parameters (temperature, pressure, precursor flow, pulse times) to achieve desired film thickness uniformity, dielectric constant, and breakdown strength.
  • Designing and fabricating test structures (e.g., MIM capacitors) to evaluate the electrical performance and reliability of the high-k dielectric layer.
  • Analyzing experimental data and implementing statistical process control (SPC) methods to ensure process stability and yield improvement.

• Skills & Technologies Demonstrated

• Software: LabVIEW (for tool control and data acquisition), MATLAB/Python (for data analysis), OriginLab (for graphing).
• Standards & Frameworks: SEMI Standards (for semiconductor manufacturing equipment and materials), ISO 9001 (Quality Management Systems).
• Competencies: Thin Film Deposition Techniques (ALD, PVD, CVD), Materials Characterization (XRD, XPS, AFM, SEM, TEM), Dielectric Physics, Semiconductor Fabrication Process Development, Statistical Process Control (SPC), Cleanroom Operations, Device Packaging Considerations.

This career episode describes the skills applied during a project focused on improving the reliability and manufacturing yield of a commercial semiconductor product. Key duties included:

• • Performing electrical parametric testing on failed Power MOSFET devices to identify specific failure modes (e.g., gate oxide breakdown, leakage current, parasitic effects).
  • Utilizing advanced physical failure analysis techniques such as Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDS), Focused Ion Beam (FIB), and Transmission Electron Microscopy (TEM) to pinpoint defect locations and root causes.
  • Collaborating with design engineers to review mask layouts and identify potential design weaknesses contributing to device failures.
  • Working with process engineers to analyze fabrication process logs and identify excursions or anomalies correlating with yield losses.
  • Proposing and validating design rule changes or process modifications to improve device robustness and manufacturing yield.
  • Preparing detailed failure analysis reports and presenting findings and recommendations to cross-functional teams and management.

• Skills & Technologies Demonstrated

• • Software: JMP/Minitab (for statistical analysis), AutoCAD/Virtuoso (for mask layout review), dedicated tester software.
  • Standards & Frameworks: IPC-TM-650 (Test Methods Manual), MIL-STD-883 (Test Methods for Microcircuits), AEC-Q101 (for Automotive Discrete Semiconductors).
  • Competencies: Semiconductor Device Testing & Characterization, Failure Analysis Methodologies (Electrical & Physical), Root Cause Analysis, Process-Design Interactions, Yield Management, Quality Control, Data Interpretation & Reporting, Problem-Solving.